High-temperature polyimide dielectric materials for energy
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Widely used in single-strand soft wire, multi-strand soft wire, hard wire, sheath wire, flat wire stripping, etc. 1. Large diameter cable is available 2. Strong stripping ability 3. With special
Electrode Degradation in Lithium-Ion Batteries | ACS
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Adhesion strength study of IBAD–MOCVD-based 2G HTS wire using a peel
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A review of surface roughness impact on dielectric film
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Small things make big deal: Powerful binders of lithium batteries
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Flexible PLZT antiferroelectric film capacitor for energy storage in
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Silver-free AMB Copper Technology Bonds Highly
A simple peel test is used in which a Cu peel strip (10 mm wide x 0.3 mm thick) is brazed onto a piece of 0.32 mm thick Si 3 N 4 ceramic using the Condura Ultra technology. The Cu is peeled off and the force is measured.
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Improving the alkali metal electrode/inorganic solid
easily from the surface of Na 3Zr 2Si 2PO 12 pellet, revealing the contact between Na and electrolyte pellet is poor. On the con-trary, Na electrode still had a large area residue on the
A review of surface roughness impact on dielectric
The peel-off force of a 3–10 nm thick biofilm from a solid surface with a wavelength ranging from 100–300 nm is generally linear versus the effective interfacial energy. This relation significantly depends on the surface
Small things make big deal: Powerful binders of lithium batteries
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VEVOR Automatic Wire Stripping Machine, 0.06''''-1.57'''' Electric
VEVOR Wire Stripping Machine features a 1500W motor, 88 ft/min speed, double blades, and 9 channels for efficient copper recycling from 0.06'''' to 1.57'''' wires. 0.06''''-1.57'''' Electric
Transparent, flexible solar cells combine organic materials, graphene
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Multi-core Cable Outer Jacket and Core Wire Peeling Off Machine
Function: wire cutting, outer sheath stripping, core wires stripping, and cable coiling (optional) Cutting length: 0.01-999,999.99mm Wire diameter: φ3mm-φ10mm Core wires: 2-8 cores
6 FAQs about [Energy storage thick wire peeling]
How does electro-capillary peeling improve thin film Detachment?
Here, we develop an electro-capillary peeling strategy that achieves thin film detachment by driving liquid to percolate and spread into the bonding layer under electric fields, immensely reducing the deformation and strain of the film compared with traditional methods (reaching 86%).
Why does peeling strength increase linearly with energy release rate?
As illustrated in Fig. 3, the peeling strength increases linearly with the energy release rate. The reason is as follows: Based on the energy balance approach, the larger the energy release rate is, the larger the peeling force is, which corresponds to a larger peeling strength, needed to break the interface.
What are the limitations of thin film peeling?
Current methods for thin film peeling suffer from limitations because of complicated preparations and the limitations of applied films. Li et al. present a peeling method for the thin film’s detachment that is achieved by driving liquid to percolate and spread into the bonding layer under electric fields.
Can electro-capillary peeling be used for reusing soft materials?
This work shows the great potential of the electro-capillary peeling method to provide a simple way to transfer films and facilitates valid avenues for reusing soft materials. Current methods for thin film peeling suffer from limitations because of complicated preparations and the limitations of applied films.
What is the thickness of a thin film profile before and after peeling?
The thin film profile before and after peeling was collected using a probe step profiler (Dektak XT, Bruker, Germany) with a 10 μN force on the microneedle (12.5 μm in diameter). The tested thin films had a diameter of 30 mm and a thickness from 25 μm to 300 μm.
Does electro-capillary peeling have a stable detachment rate?
Statistical results of peeling length revealed that the electro-capillary peeling method had a stable detaching rate in the long-term detachment when the electrolyte solution was adequate. In addition, we investigated the characterization of the substrate and thin film after electro-capillary peeling (Supplementary Figs. 9, 10).